Nvidia will unveil Blackwell’s next-generation GPU architecture at the GTC 2024 keynote tomorrow.
According to XpeaGPU, the upcoming B100 GPU will use two chips based on TSMC’s CoWoS-L packaging technology, using advanced 2.5D packaging technology. This technology can stack chips together to increase processing power while saving space and reducing power consumption. Consumption.
XpeaGPU disclosed that the B100 GPU will feature two computing chips connected to eight 8-Hi HBM3e memory stacks, totaling a capacity of 192GB. It is worth mentioning that AMD has equipped 8 HBM3 chips on its Instinct MI300 GPU, providing the same capacity of 192GB of video memory.
In the future, according to the tipster, the next-generation Blackwell GPU, codenamed B200, is expected to adopt 12-Hi technology to achieve higher capacity. The video memory is expected to reach 288GB, as anticipated. However, it hasn’t been disclosed whether it will utilize HBM3e or HBM4 technology.
NVIDIA has previously teased the exceptional performance of the B100 GPU and has confirmed its launch for 2024.
